Электронный каталог

Статья

Sheremetev, A.D.
The Quality Assurance Test System for Assembly of STS Modules for the BM@N Experiment : [Abstract] / A.D.Sheremetev, A.A.Kolozhvari, D.V.Dementev, M.O.Shitenkov, Yu.A.Murin // Физика элементарных частиц и атомного ядра. Письма. – 2023. – Т.20, №4. – P.618. – URL: http://www1.jinr.ru/Pepan_letters/panl_2023_4/09_Sheremet_ann.pdf.

The Silicon Tracking System (STS) of the BM@N experiment will be based on modules with Double-Sided microstrip Silicon Detectors (DSSD) which have been initially developed for the CBM experiment at FAIR. Each module consists of a DSSD, two front-end boards with 8 STS-XYTER ASICs each, and a set of low-mass aluminum microcables. During the module assembly, the microcables are tab-bonded to the sensor and readout STS-XYTER ASICs. The module has 1024 channels on each side of the sensor. For the quality assurance of the ultrasonic bonding process, a dedicated procedure based on the noise per channel measurements with a Pogo Pin test device was developed.



ОИЯИ = ОИЯИ (JINR)2023
Спец.(статьи,препринты) = С 344.1т - Вопросы измерений в трековых камерах
Спец.(статьи,препринты) = С 344.3е - Системы электронных блоков для физических измерений: для временных измерений, логические схемы, спектрометрические
Бюллетени = 41/023